The most popular multi wire cutting machine for 30

2022-07-29
  • Detail

China has successfully developed 300 mm multi wire cutting machine for silicon materials

the major national science and technology project undertaken by China Electronics Technology Group Corporation has made a breakthrough recently. The successful development of 300 mm multi wire cutting machine for silicon materials has broken the current situation that all the 12 inch multi wire cutting machines running on-line in China are imported equipment

according to Wangzhigang, general manager of China Electronics Technology Corporation, the developed practical model can cut more than 400 12 inch silicon wafers at a time to meet the requirements of the production line with the development of technology. The technology can be applied to solar cells, which are long and complex processes. At present, CETC has signed a strategic cooperation agreement with large international solar wafer enterprises

Copyright © 2011 JIN SHI